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PCB/FPC/Rigid Flex Capability

PCB FPC Rigid-FLex
Layers 1-18 1-6 2-12
Copper thickness 1/3 ounce to 4 ounce 1/3 ounce to 1 ounce 1/3 ounce to 2 ounce
Core Thickness 0.05mm to 3.2mm 12.5um / 25um / 50um
Max Panel Size 457mm×610mm 18 "×24 " 250mm×500mm 9.8 "×19.8 " 250mm×500mm 9.8 "×19. 8 "
HDI 2 + N + 2 N / A 1 + N +1
PCB FPC Rigid-FLex
Min. VIA Size 0.1mm /0.004”（mechanical） 0.075mm /0.003” (laser) 0.1mm /0.004”（mechanical） 0.1mm /0.004”（mechanical） 0.075mm /0.003”（laser）
Aspect Rat 8:1 4:1 8:1
Solder Mask Thickness 10-40 um 10-40 um 10-40 um
Registration (solder mask and pattern) +/-0.05mm +/-0.05mm +/-0.05mm
Trace to outline +/-0.05mm +/-0.05mm +/-0.05mm
Outline Tolerance +/-0.075mm +/-0.05mm +/-0.075mm
Min. Line Width/Space 0.05mm / 0.002” 0.05 mm / 0.002” 0.075mm / 0.003”
Impedance Tolerance +/- 8 % +/- 10%
PCB FPC Rigid-FLex
Min. VIA Size 0.1mm /0.004”（mechanical） 0.075mm /0.003” (laser) 0.1mm /0.004”（mechanical） 0.1mm /0.004”（mechanical） 0.075mm /0.003”（laser）
Aspect Rat 8:1 4:1 8:1
Solder Mask Thickness 10-40 um 10-40 um 10-40 um
Registration (solder mask and pattern) +/-0.05mm +/-0.05mm +/-0.05mm
Trace to outline +/-0.05mm +/-0.05mm +/-0.05mm
Outline Tolerance +/-0.075mm +/-0.05mm +/-0.075mm
Min. Line Width/Space 0.05mm / 0.002” 0.05 mm / 0.002” 0.075mm / 0.003”
Impedance Tolerance +/- 8 % +/- 10%
item Min. Max.
Surface Treatment ENIG Au 0.02um(0.8u") Au 0.2um(8u“)
Ni 2.54um(100u") Ni 6um (240u")
Flash Gold Plating 0.01um (0.4u") 0.05um(2u")
Soft Gold Plating 0.05um (2u") 0.5um(20u")
Hard Gold Plating 0.05um (2u") 1.0um(40u")
ENEPIG Au 0.02um Au 0.1um
Ni 2.54um(100u") Ni 6um (240u")
Pd 0.03um (1.2u") Pd 0.2um (8u")
O.S.P 0.20um (8u") 0.60um (24u")

SMT Capability

Item Component Max Size Min
1 PCBA L*W 510mm*460mm 50mm*50mm
2 IC/Chip 65*65 mm 01005
3 Connector N/A 0.3mm Pitch
4 BGA 65*65 mm 0.4mm Pitch
Component R, C, L, CAL, Diode, LED, SOP, SOJ, PLCC. QFP, BGA, CSP, Connector, Transformer